Placeholder IPC-4U industrial computer in electronic manufacturing vision usage scenarios | SINSMART

AOI visual inspection solution

1. Application scenario: PCBA optical inspection

In the production process of electronic products, printed circuit boards, as the support body of electronic components and the provider of circuit connections of electronic components, have become an absolute dominant position in the electronics industry, and PCBA is the PCB empty board passed through SMT. Or through the entire process of DIP inserts.

As the core and foundation of the whole system, PCBA's manufacturing quality directly affects the reliability of electronic products, so the inspection of PCBA production process is particularly important. In traditional PCBA testing, manual testing is extremely susceptible to interference from its own and external factors. In addition, the in-depth development of electronic assembly to higher-density, smaller-sized PCBA hybrid technology has gradually imposed stricter requirements on PCBA testing.

2. Customer needs:

① Efficient, fast and accurate detection of PCBA requires strong data processing capabilities;

② The external connection is compatible with a variety of functional modules, which requires super scalability;

③ To ensure the stable and fast transmission of test data, stable computing power and network environment are required.

3. System architecture diagram:

IC chip feeding detection solution

1. Application scenario: IC chip loading inspection

In the process of chip production and manufacturing, the various technological processes are interlocking, the technology is complex, and slight changes in materials, environment, process parameters and other factors often lead to chip defects and affect product yield. As a key link in the chip production line, chip quality inspection can actively feed back product quality information so that people can timely control the health status of each production link.

During the inspection process, the IC chip arrives at the inspection area through the feeding tray, and the high-definition camera automatically scans the surface of the inspected material to achieve image acquisition, and compares the image with the qualified parameters in the database to identify defective products and sort them to the defective area. Reduce defective rate.

2. Customer needs:

① Efficient, fast and accurate detection of multiple IC chips at the same time requires strong data processing capabilities;

② The external connection is compatible with a variety of functional modules, which requires super scalability;

③ To ensure the stable and fast transmission of test data, stable computing power and network environment are required.

System architecture diagram:

Photovoltaic silicon wafer laser scribing detection solution

1. Application scenario: Photovoltaic silicon wafer laser scribing inspection

The photovoltaic industry chain structure consists of three parts: upstream silicon materials and silicon wafers, midstream photovoltaic cells and photovoltaic modules, and downstream power generation applications. Among them, the processing of silicon wafers into solar cells in the midstream link is the most core step to realize photoelectric conversion. The production process involves: silicon wafer detection - surface texturing and pickling - diffusion junction - dephosphorous silicon glass - plasma etching And pickling - anti-reflection coating - screen printing - rapid sintering - sorting - scribing - serial welding, etc.

Laser scribing is a relatively advanced technical method at present. The high-energy laser beam is used to irradiate the surface of the workpiece, and the irradiated area is partially melted and vaporized to achieve the purpose of scribing. To ensure the accuracy and stability of its equipment during the scribing process.

2. Customer needs:

① To ensure the stable and fast operation of the laser scribing machine software, strong computing power is required;

② The external connection is compatible with a variety of functional modules, which requires super scalability;

③ To ensure the stable and fast transmission of test data, stable computing power and network environment are required.

3. System architecture diagram:

Precision laser welding solution

1. Application scenario: precision laser welding

Laser welding is a welding method that uses a high-energy-density laser beam as a heat source to conduct heat on the surface of the workpiece and diffuse it to the inside. By controlling the energy, width, and repetition frequency of the laser pulse, the workpiece is melted and reshaped. The seams are smooth and the positioning accuracy is high.

Enterprises in industries such as lithium batteries, photovoltaics, and semiconductors provide high-precision equipment solutions such as laser marking, laser cutting, and laser welding, in order to ensure the stable operation of their precision welding equipment in complex industrial environments;

2. Customer needs:

① During the welding process of the equipment, multi-axis linkage adjustment of the motion control system, vision system and welding fixture axis is required to ensure the accuracy of the welding spot position. In order to ensure the accurate and stable operation of the equipment software control system, powerful computing performance is required;

② The external connection is compatible with a variety of functional modules, which requires super scalability;

③ To ensure the stable and fast transmission of test data, stable computing power and network environment are required.

3. System architecture diagram:

5. Semiconductor packaging solutions

1. Application scenario: semiconductor packaging

Semiconductor dicing machine is the key equipment in the production of semiconductor chips. Its function is to cut the prepared wafer into unit chips and prepare for the next bonding process. The working mechanism includes automatic loading and unloading, automatic alignment, automatic cleaning, automatic cut and so on.

2. Customer needs:

① To ensure the stable and efficient operation of the dicing machine, strong computing power is required;

② The external connection is compatible with a variety of functional modules, which requires super scalability;

③ To ensure the stable and fast transmission of test data, stable computing power and network environment are required.

3. System architecture diagram:

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